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Semiconductor Industry

2026-07-06
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Applications · Semiconductor Wet Cleaning

JONSN Precision Micro Gear Pumps for Semiconductor Wet Cleaning Equipment: Zero-Leaching Flow Control for High-Purity Chemicals

Pulsation-free delivery of ultra-pure acids, bases and solvents (HF, H2SO4, H2O2, developers) at temperatures from -40°C to 90°C — engineered for 12-inch wafer single-wafer wet benches and advanced-node mass production.

Zero metal-ion leaching
-40°C to 90°C range
94.3% volumetric efficiency
±0.5% flow reproducibility
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Drawbacks of Conventional Semiconductor Dosing Pumps

Pumps currently integrated into front-end wet benches suffer from fatal failure modes that directly compromise 12-inch wafer processing yield and long-term mass-production safety.

Traditional Diaphragm & Bellows Pumps
When conventional pneumatic diaphragm or bellows pumps are integrated into semiconductor front-end wet benches, their reciprocating mechanism inevitably generates severe fluid pulses and volumetric overshoots within the chamber. This frequent flow-velocity deviation in 12-inch wafer micro-groove cleaning leads to non-uniform fluid shear stress and chemical dead zones, directly causing incomplete micro-particle removal or localized over-etching defects — failing the rigid metrics of advanced-node manufacturing.
Conventional Shaft-Seal & Metal Gear Pumps
Conventional gear pumps with standard dynamic shaft seals or mechanical seals experience rapid seal degradation and structural failure when conveying highly corrosive, strongly oxidizing semiconductor-grade fluids (concentrated HF, H2SO4, H2O2 mixtures) due to combined chemical attack and frictional heat, triggering high-risk chemical hazards. More catastrophically, microscopic heavy-metal ions (Fe, Cr, Ni) leached from metal friction paths contaminate the silicon lattice of wafers, leading to wafer contamination and yield loss..
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Three Wafer-Grade Technological Breakthroughs & Client Testimonial

JONSN's solid technical advantages for front-end semi wet cleaning come from a fully redesigned material stack (UK Victrex PEEK gears + Zirconia nano-ceramic shafts) and a fully integrated two-stage housing, validated by an authentic 14-month field testimonial from a world-leading tool manufacturer.

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MATERIAL INNOVATION
Pure PEEK Gears + Zirconia Nano-Ceramic Shaft Pins
JONSN completely abandons ordinary carbon-fiber filled rotors and soft metal shafts. Gears are molded with pure unfilled, wear-resistant PEEK from UK Victrex; transmission shafts and pins are forged with 100% rigid Zirconia nano-structural ceramics. This friction pair shows extreme chemical inertness and near-zero wear in non-lubricating semiconductor cleaning chemistry, cutting metal-ion leaching and micro-debris flaking from contaminating the process.
BEARING INNOVATION
Self-Lubricating Composite Bearings · 20,000 h Service Life
Erasing old grease-lubricated bearings that trigger severe organic contamination and aggressive chemical reactions on wafer surfaces, JONSN standardizes internal sliding bearings with a modified PEEK-ceramic composite recipe. It delivers oil-free self-lubricating efficiency and dry-friction resistance under heavy system counterpressure, securing a verified continuous running lifespan exceeding 20,000 hours and drastically cutting unexpected downtime on tool sets.
SEALING INNOVATION
Two-Stage Housing + Magnetic-Driven Static Sealing
JONSN overturns conventional multi-segment configurations vulnerable to gasket variation and chemical leakage causing flow drift. An integrated two-stage shell with zero fluid-trapping dead volumes is rigidly locked by world-class CNC centers, driven by a static magnetic driver instead of dynamic seals. Internal bypass is reduced below micro-levels, withstanding continuous start-stop counterpressure and steering volumetric efficiency toward perfection.
CUSTOMER PROOF
14-Month Testimonial from a Front-End Wet Bench Tool Maker
"JONSN's micro magnetic pump integrated into our advanced single-wafer wet bench chemical replenishment module easily passed our most stringent heavy-metal-ion leaching and organic micro-particle extraction audits. After 14 months of high-frequency operation under heavy counterpressure, its flow-reproducibility variance remains rigidly restricted within ±0.5%, significantly boosting the yield rate of 12-inch wafer trench processing and validating an impeccable uniform quality standard."

JONSN R&D Testing Center Verified Reference

Advanced Microfluidic Dynamics Validation and System Flow Calibration Datasheet

DATASHEET
MPG · Verified Semiconductor Performance · Issued July 5, 2024

Factory calibration datasheet covering working medium, thermal range, differential pressure, theoretical vs. real flow, volumetric efficiency and motor spec — measured on a high-cleanliness, high-pressure full-inspection calibration bench at JONSN's Ganzhou Intelligent Manufacturing Base.

ParameterSpecification
Working MediumUltra-high Purity Semiconductor Chemicals / Wafer-grade Process Stripping Solution
Liquid Viscosity: 1.0-3,000 MPa·s
Specific Gravity: 0.5-1.2 g/cm³
Design TemperatureBorder environmental testing scope: Min -40°C to Max 90°C
Differential PressureDesign differential working pressure: 4 bar
Maximum system pressure capacity: 4 MPa
Pipe DimensionsSuction line length: 1 m
Suggested inlet pipe diameter: DN10 mm
Discharge line length: 5 m
Theoretical Flow Rate1-135ml /min
Real Flow RateAfter testing by the flowmeter, the flow remains highly consistent and is controlled within ±0.5%
Volumetric EfficiencyEffhydr = 94.3%
Demonstrating absolute precision control under high-frequency start-stop ultra-low viscosity fluid conditions.
Motor SpecificationMotors can be selected based on working conditions, including brushless motors, AC motors, stepping/servo motors, variable frequency motors, and explosion-proof motors
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Engineering Drawings for Wet Bench Integration

Comprehensive 2D mechanical assembly drawings and structural layout metrics help global semi equipment OEMs run seamless embedded co-design. All standard port threads, overall motor length & height, recommended inlet pipe diameter and mounting hole array are documented for space-interference checks inside coMPact single-wafer cleaning enclosures.

How JONSN Attains Zero-Metal Leaching Standards for Semis Chemical Pumps?

Advanced CNC infrastructure seals fluidic surface roughness to eliminate manual deburring variance and secondary micro-particle risks.

Two-Stage Structure & Precision Machining
Advanced Semiconductor Tool Manufacturing: Critical chemical flow paths and two-stage pump casings are carved seamlessly by onsite Japanese Mazak Multi-Axis CNC Machining Centers and Tsugami CNC lathes. By securing structural metrics at the micron level using automated double-plane lapping, JONSN eliminates manual deburring and random adjustments, completely eradicating internal bypass and sample trapping dead-volumes.
Rigid Semis Quality Controls: Operating under TÜV Rheinland ISO 9001:2015 specifications, JONSN deploys a calibrated 20±2°C constant temperature dust-free semiconductor tools assembly zone. Executing a strict "One Item, One Code" tracking matrix, 100% of final tolerances are certified by German ZEISS CMM, locking batch volumetric efficiency variances within ±0.5% to guarantee consistent high-volume mass OEM delivery safety.
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Global Authority Industrial Certificates

Validated for Global Semiconductors & Front-End Device Audits: All JONSN precision micro gear pumps are fully certified by TÜV Rheinland ISO 9001:2015, CE Security Mark, and RoHS Green Environmental Compliance. It perfectly matches the non-toxic, sustainable material criteria and severe quality auditing protocols of global high-end wafer wet benches machinery OEMs.

TÜV Rheinland ISO9001:2015 logo
TÜV Rheinland
ISO 9001:2015
Quality system certification for global semi manufacturing supply chains.
CE safety mark
EU CE Mark
Safety Compliance
Mandatory conformity for European wet bench & electronic OEMs.
RoHS
EU RoHS
Environmental Compliance
Zero hazardous-material leaching for global front-end electronics.

Frequently Asked Questions

How does JONSN ensure absolute pulse-free chemical loop stability to prevent particle contamination on wafers?

Traditional reciprocating bellows or diaphragm pumps create severe fluid pressure spikes and velocity fluctuations, causing non-uniform fluid shear stress and chemical dead zones that trap particles on wafers. JONSN utilizes an advanced positive-displacement magnetic-driven mechanism that guarantees an absolute pulse-free uniform flow, facilitating comprehensive chemical fluid exchange inside 12-inch wafer sub-micron trenches and removing microscopic impurities completely.

Can JONSN semiconductor pumps resist highly corrosive hydrofluoric acid (HF) and oxidizing SPM mixtures up to 120°C?

Yes. As calibrated in our MPG technical report, JONSN non-standard custom pumps feature an elite operational temperature scope from min: -40°C to max: 120°C. Built with premium imported wear-resistant PEEK gears from UK Victrex and 100% Zirconia structural-ceramic shafts, the fluid paths successfully resist aggressive acidic corrosion and heavy chemical erosion without localized leakage or geometric thermal deformation.

How does JONSN guarantee zero heavy-metal-ion leaching in front-end wet cleaning fluid blocks?

Conventional metal-rotor gear pumps rely on dynamic seals that create dynamic abrasion, introducing Fe, Cr or Ni debris into high-purity chemicals and causing silicon-lattice short circuits. JONSN integrates a static magnetic sealing design to completely remove friction seals. Supported by pure wear-resistant PEEK and nano-structural ceramic shafts, it achieves zero metallic contamination, meeting strict electronics-grade cleanliness standards.

Does JONSN offer flexible space-array customization for limited-space multi-bath single-wafer cleaning clusters?

Yes. For limited-space configurations inside coMPact wet bench cluster blocks, JONSN provides highly integrated micro-customization options (such as the MRA series), supporting flexible engineering co-design. Technical leaders can check our 2D engineering drawings and request 3D STEP models within 24 hours to prevent installation-space interference.

Please Contact Us!

ADDRESS

Building A3, Qiuyue Science and Technology Park, Ganzhou Economic and Technological Development Zone, Jiangxi Province

Tel.

0086-21-34720020

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