Advanced semiconductor packaging is a core technology to improve chip performance in the post-Moore’s Law era, covering key processes including bump electroplating, TSV (Through-Silicon Via), redistribution layer (RDL) and damascene electroplating. These processes impose extremely strict standards on plating liquid metering accuracy, chemical stability and pulsation control. Any tiny flow deviation or medium fluctuation will directly damage the yield and reliability of wafer-level packaging.
Copper sulfate plating solution (CuSO₄), process additives (accelerator, leveler, inhibitor), various acidic & alkaline plating liquids and chemical process fluids.
JONSN-MPG (Micro Precision Gear Pump) series is a miniature precision metering gear pump independently developed by JONSN for semiconductor wet processes. It is specially designed for micro-flow, high-precision and highly corrosive fluid conveying conditions. The pump has passed strict full-condition tests by leading manufacturers including Advanced Micro-Fabrication Equipment (AMEC) and Naura Technology, and has been installed and matched on their equipment in mass production.
Parameter | Specification |
Model Series | JONSN-MPG |
Rated Flow Rate | 100 mL/min (customizable range: 50~500 mL/min) |
Maximum Output Pressure | 10 bar |
Flow Control Accuracy | ≤ ±0.2% (far superior to the general industry standard of ±1%) |
Pulsation Rate | ≤ 1% |
Leakage Standard | Zero leakage |
Driving Mode | Precision servo motor drive; closed-loop flow feedback optional |
Sealing Structure | Magnetic coupling, no dynamic seal |
Component | Material | Technical Advantages |
Pump Head | Hastelloy C-276 | Excellent resistance to acid, alkali and chloride corrosion; suitable for long-term immersion in plating solutions |
Gear Shaft | Ceramic + PEEK Composite | High hardness, low friction, resistant to abrasive wear |
Shaft Sleeve | PEEK Ceramic Composite | High mechanical strength & chemical inertness; no metal ion precipitation |
Gear | Special Alloy / Ceramic (Optional) | Precision ground; meshing clearance controlled below 5μm |
Ultra-high metering accuracy: Mixing error of plating liquid must be controlled within ±0.5% to guarantee uniform coating thickness (Wafer-in-Wafer uniformity WiW ≤ 3%).
Ultra-low pulsation: Excessive pulsation will cause micro uneven coating and bubble defects; required pulsation rate ≤ 1%.
Excellent corrosion resistance: Most plating solutions are strong acid/alkaline systems (pH 0~14) with high-concentration metal ions; pump materials must sustain long-term chemical erosion.
Zero metal ion pollution: Medium-contact components shall not release metal ions to avoid contaminating plating liquid and wafers.
Zero leakage: Semiconductor cleanrooms ban any chemical leakage; magnetic drive structure realizes fully enclosed delivery without dynamic seals.
7×24-hour long-cycle continuous operation: Production lines run nonstop; equipment shall operate stably under rated conditions for at least 8,760 hours per year.
Plating Liquid Storage Tank
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0.1μm Precision Filtration Unit
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JONSN-MPG Precision Metering Gear Pump
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Defoaming & Degassing Module
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Electroplating Chamber (Wafer-level Plating Tank / Spray Nozzle)
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Overflow Recovery → Circulation Storage Tank
Servo motor drives MPG gear pump to deliver plating liquid at fixed rotational speed for precise flow output. Flowmeter can be equipped for real-time feedback to build closed-loop control. The controller compares actual instantaneous flow with set value and automatically adjusts motor speed, ensuring flow deviation ≤ ±0.5% throughout the whole process.
Advantage Category | Detailed Description |
Outperforms Imported Brands | In full-cycle long-term tests conducted by AMEC, its accuracy, stability and service life exceed German imported pumps, realizing domestic substitution. |
Recognized by Top Semiconductor Manufacturers | Qualified supplier for three major semiconductor enterprises: AMEC, Naura Technology and HZBST. |
Ultra-low Pulsation Technology | Precision ground gears & multi-tooth meshing design, pulsation rate ≤ 1%, ensuring micro-uniform coating. |
Customizable Full-material Solution | Multiple material combinations including Hastelloy, ceramic and PEEK to match different chemical media and process windows. |
Closed-loop Quality Control System | Strict procedures: raw material inspection → precision gear grinding → high-precision assembly → full calibration before delivery, eliminating batch quality difference. |
Independent Fluid Test Laboratory | Equipped with full-condition simulation, aging test and precision calibration capacity, holding multiple independent patents. |
Fully Independent Industrial Chain | Self-developed design, production and quality inspection; free from imported supply chain restrictions; faster delivery and after-sales response than imported products. |
Authoritative Certifications | ISO9001, CE, ClassNK Certification |
JONSN-MPG series precision metering gear pump is tailor-made for advanced semiconductor packaging electroplating processes. With four core strengths: ultra-low pulsation, zero leakage, ultra-high precision and superior corrosion resistance, it helps domestic semiconductor equipment break through high-end fluid control technical barriers and achieve critical breakthrough from "technological bottleneck" to "controllable domestic substitution".
