1. Overview
Photoresist (PR) is the key medium determining pattern transfer quality in semiconductor manufacturing. Its delivery system must strictly stabilize the flow rate, viscosity and temperature of photoresist for nanometer linewidth processes. Slight flow fluctuation or bubble entrainment will trigger linewidth deviation, pattern defects or scrapped wafer batches.
| Index Category | Industry Requirement | Typical Range |
|---|---|---|
| Flow Accuracy | Steady flow fluctuation ≤ ±0.5% | 0.01–50 mL/min |
| Flow Repeatability | Batch-to-batch deviation ≤ ±1% | Stable operation ≥72h without performance attenuation |
| Bubble Control | No bubbles generated during delivery | Dissolved gas ratio < 0.01% |
| Viscosity Adaptability | Compatible with high-viscosity photoresist | 1–5,000 cP |
| Chemical Compatibility | Resist organic solvents, acidic & alkaline developer | PTFE / PEEK / SS316L materials |
| Temperature Control | Medium temperature accuracy ±0.5°C | Constant temperature delivery: 15–40°C |
| Particle Control | Output particle cleanliness ≤ Class 5 | ISO 14644-1 Cleanroom Standard |
JONSN-MRA series magnetic drive gear pump is specially developed for precise delivery of semiconductor process fluids, featuring seal-free zero leakage, stable precise flow and wide chemical compatibility.
| Parameter | MRA Series Specification |
|---|---|
| Driving Mode | Magnetic drive (seal-free, zero leakage) |
| Flow Range | 0.01 – 50 mL/min |
| Flow Accuracy | ±0.3% ~ ±0.5% |
| Batch-to-batch Flow Consistency | ±0.5% ~ ±1% |
| Displacement Per Revolution | 0.05 – 0.50 mL/rev |
| Maximum Outlet Pressure | 0.6 – 1.0 MPa |
| Adaptable Viscosity Range | 1 – 5,000 cP |
| Pump Body Material | PTFE / PEEK / SS316L |
| Gear Material | PEEK / PTFE / SS316L |
| Temperature Control Interface | Optional integrated heating jacket (±0.5°C precision) |
| Port Size | 1/8" – 1/4" NPT |
| Cleanliness Grade | ISO Class 5 |
| Applicable Media | Photoresist / Developer / Etchant / CMP Slurry |
Photoresist Storage Tank with Constant Temperature Pre-circulation↓Filtration & Particle Removal Unit↓Suction by JONSN-MR Series Magnetic Gear Pump↓Precision Metered Output↓Coating / Dispensing Terminal
Magnetic Seal-free Drive, Zero Leakage & Zero Bubble EntrainmentMRA series adopts magnetic coupling transmission to completely avoid wear and leakage risks of traditional mechanical seals. Fully enclosed flow channel prevents air intake, realizing bubble-free photoresist delivery, an essential requirement for sub-10nm advanced processes.
High-precision & Consistent Flow, No Batch DeviationPrecision meshing gear cavity ensures fixed displacement per rotation. MRA flow accuracy reaches ±0.3%; flow attenuation less than 0.1% after 72h continuous operation, batch-to-batch consistency ±0.5%, realizing closed-loop control of wafer film thickness uniformity.
Full Chemical Compatibility, Single Pump for Multiple MediaThree material systems (PTFE/PEEK/SS316L) cover all semiconductor process liquids including photoresist, TMAH developer, HF/H₂SO₄ etchant and CMP slurry without cross-contamination, supporting multi-process switching with one pump.
Low-shear Design to Protect Medium Molecular StructureOptimized gear profile and clearance reduce internal shear stress, preventing fracture of photoresist polymer chains and agglomeration of CMP slurry particles, maintaining original medium performance during delivery.
Integrated Temperature Control for Viscosity Closed-loop LockingOptional heating jacket and temperature sensors integrate temperature control on pump body with ±0.5°C accuracy to stabilize photoresist viscosity, eliminating extra external temperature control modules and simplifying system layout.
Cleanroom Design Compliant with ISO Class 5Internal pump surface roughness Ra ≤ 0.4μm, dead-space-free flow path supporting full CIP cleaning coverage. Output particle standard meets ISO 14644-1 Class 5, suitable for 10nm and below process nodes.
