1. Overview
CMP (Chemical Mechanical Polishing) is a critical process in wafer manufacturing. Stable, precise and contamination-free transportation of CMP Slurry (core consumable) directly determines wafer planarization quality and production yield. JONSN-MRA series precision magnetic gear pump is designed for conveying corrosive nano-abrasive slurries such as CMP Slurry. It provides reliable fluid delivery solutions for semiconductor manufacturing via three core designs: magnetic drive zero leakage, low-shear stable flow and full corrosion-resistant flow channels.
| Pain Point | Description | Negative Impact on Production |
|---|---|---|
| Abrasive Wear | CMP slurry contains hard nano SiO₂/Al₂O₃/CeO₂ abrasives, causing fast wear of internal parts of ordinary pumps | Short pump service life, frequent maintenance, high downtime cost |
| Particle Agglomeration & Sedimentation | Abrasive particles agglomerate and settle under low flow velocity or high shear zones, leading to uneven particle distribution | Unstable polishing rate, scratches or dishing defects on wafer surface |
| Chemical Corrosion | Slurries cover wide pH range (acidic to alkaline) with corrosive oxidants and complexing agents | Corroded pump releases metal ions to pollute slurry, lowering wafer yield |
| Flow Pulsation | Polishing requires continuous uniform slurry supply; pulsation causes inconsistent polishing effect | Poor wafer planarization uniformity, local over-polishing or under-polishing |
| Shear Degradation | High shear force destroys abrasive particle size distribution and suspension stability | Slurry performance declines, effective abrasive particle proportion decreases |
| Requirement Category | Specific Index |
|---|---|
| Flow Accuracy | Within ±1% to stabilize polishing rate |
| Flow Pulsation | <3% to maintain continuous uniform slurry supply |
| Corrosion Resistance | Full PTFE/ceramic flow channel, compatible with pH 1~14 full range |
| Metal Ion Pollution Control | No exposed metal inside flow path, dissolved ion content < 1 ppb |
| Shear Control | Low-shear structure to keep abrasive D50 particle size unchanged |
| Sealing Mode | Magnetic coupling without dynamic seals for zero leakage, avoiding environmental pollution and slurry spillage |
| Cleaning Compatibility | Support CIP online cleaning, dead-space-free flow channel to prevent cross-contamination |
| Protection Grade | IP55 or above, suitable for cleanroom environment |
Consistent with the parameter table listed in Photoresist Delivery Document above.
CMP Slurry Supply Tank↓Filtration & Particle Control Unit↓Precision Metering Delivery by JONSN-MR Series↓Closed-loop Flow Control↓Slurry Supply to Polishing Head↓CIP Online Cleaning
| Advantage | Technical Support | Value for Clients |
|---|---|---|
| Zero Leakage Magnetic Drive | Magnetic coupler replaces traditional mechanical seal, no dynamic sealing points | Prevent slurry leakage and cleanroom pollution, meet strict cleanroom standards |
| Full Corrosion-resistant Flow Channel | Pump cavity and gears lined with PTFE + engineering ceramic | Resist pH 1~14 full-range corrosion, metal ion dissolution < 1 ppb |
| Low-shear Stable Flow Design | Optimized gear profile & clearance matching to control fluid shear rate | Protect abrasive particle size distribution, extend effective service life of slurry |
| High-precision Metering | Precision gear processing + servo drive, flow accuracy ±0.5%~1% | Stable polishing rate, improve wafer planarization consistency |
| Ultra-low Pulsation | Multi-tooth gear + anti-pulsation structural design | Flow pulsation <3%, avoid uneven polishing defects |
| Long Wear-resistant Service Life | High-hardness engineering ceramic gears | Service life 3~5 times longer than ordinary pumps, cut maintenance cost |
| CIP Compatible Structure | Dead-space-free smooth flow channel, support automatic online cleaning | Reduce production line downtime, avoid cross-contamination |
| Common Problem | Root Cause | JONSN Optimized Solution |
|---|---|---|
| Short pump service life, frequent replacement | Nano abrasive continuously scours and wears internal components | Adopt engineering ceramic gears + PTFE-lined pump cavity, service life increased 3~5 times |
| Excessive metal ion content in slurry | Corroded metal pump parts release ions to contaminate slurry | Full plastic/ceramic flow channel without exposed metal, ion dissolution <1 ppb |
| Unstable polishing rate | Unstable flow & severe slurry supply pulsation | Servo drive + closed-loop control, pulsation <2%, flow accuracy ±0.5% |
| Slurry particle agglomeration & sedimentation | High-shear dead zones or low-flow areas inside pump | Low-shear gear profile + dead-space-free flow channel to keep particles evenly suspended |
| Difficult cleaning during material switching | Dead corners inside pump cavity with residual slurry | CIP optimized design with smooth flow channel without retention for automatic online cleaning |
| Pipeline leakage risk | Traditional mechanical seal fails easily under corrosive conditions | Magnetic coupling seal-free structure fundamentally eliminates leakage risk |
JONSN-MR series precision magnetic gear pump adopts magnetic drive zero leakage, full corrosion-resistant flow channel and low-shear stable flow design, providing high-precision, high-reliability and zero-pollution fluid delivery solutions for semiconductor CMP slurry transportation.
